Thermal simulation for LED lighting, LiDAR, automotive ECU, aerospace avionics, telecom, and industrial electronics enclosures. Predict component temperatures, optimise heat sinks, and validate cooling strategies before prototype fabrication.
CFD thermal simulation services for water treatment equipment.
CFD thermal simulation for LED lighting enclosures and heat sinks.
CFD thermal mixing simulation for tanks, reactors, and process vessels.
CFD thermal simulation for LiDAR enclosures. Predict laser diode temperature, prevent optical window condensation, and validate.
Every electronic enclosure is a thermal management challenge. Heat generated by LEDs, LiDAR sensors, ECUs, avionics, telecom equipment, and industrial controllers must be removed efficiently to prevent overheating, performance degradation, and premature failure. Reynolds & Bauhm's CFD enclosure thermal simulation predicts internal air temperature, component junction temperatures, and heat sink performance under real-world operating conditions – from desert sunlight to arctic cold, from high-altitude thin air to coastal salt spray.
End-to-end CFD thermal analysis for electronic and optoelectronic enclosures across every industry and environment.
Street, industrial, horticultural, and automotive LED heat sink optimisation. Predict junction temperature, lumen depreciation, and thermal runaway for lifetime warranty validation.
Learn MoreThermal and environmental protection for autonomous vehicle, drone, and surveying LiDAR. Manage self-heating, solar gain, and sealed-optics thermal drift.
Learn MoreECU, BMS, ADAS, and infotainment enclosures for under-hood, under-body, and cabin mounting. Survive -40°C to +85°C ambient with thermal shock and vibration.
Learn MoreAvionics, satellite, UAV, and ground support equipment thermal management. Altitude effects, radiation heating, and conduction-cooled chassis optimisation.
Learn MoreTelecom cabinets, data center edge nodes, industrial PLCs, and outdoor IoT gateways. Passive, forced-air, and liquid-cooled enclosure design.
Learn MoreWater treatment and industrial electrical enclosures for tropical, desert, and coastal environments. IP66/IP67 with active cooling and anti-condensation.
Learn MoreElectronic enclosures experience coupled heat transfer through natural convection inside the cavity, forced convection from fans and blowers, conduction through mounting rails and heat sinks, radiation between hot components and enclosure walls, and external convection and radiation to the ambient environment. Our conjugate heat transfer models solve all modes simultaneously with geometry-resolved detail.
We model at the component level – individual ICs, MOSFETs, LED arrays, laser diodes, power supplies, and capacitors – with their specific heat dissipation, package thermal resistance, and junction-to-case characteristics. This granularity identifies the true thermal bottleneck rather than assuming average enclosure behaviour.
| Ambient Temperature Range | -55°C to +85°C (automotive/aerospace extended) |
| Internal Target Temperature | Component-dependent: typically Tj < 105-150°C |
| Heat Flux Density | 0.1 – 50 W/cm² (LED/LiDAR to low-power IoT) |
| Natural Convection HTC | 5 – 25 W/m²K (enclosure internal surfaces) |
| Forced Convection HTC | 25 – 150 W/m²K (fan-cooled heat sinks) |
| Heat Sink Thermal Resistance | 0.1 – 5.0 K/W (size and airflow dependent) |
| Solar Load (peak) | 1,000 W/m² (horizontal surface, clear sky) |
| Altitude Derating | Air density 50% at 5,500 m; fan flow derates linearly |
PCB, component, heat sink, and enclosure CAD imported. Simplification rules preserve thermal-critical features while enabling efficient meshing.
Power budget±10% to individual components from schematics and datasheets. Special attention to hotspots, voltage regulators, and RF power amplifiers.
Conformal or immersed boundary mesh with refinement around heat sinks, small gaps, and fan rotors. Boundary layer resolution for y+ < 5 on heat transfer surfaces.
Boussinesq or ideal-gas buoyancy, rotating reference frames for fans, conjugate solid conduction, and surface-to-surface radiation modelled simultaneously.
Startup, duty cycle, and seasonal transient runs. Design of Experiments on heat sink geometry, fan speed, vent area, and material selection.
Temperature contour plots, component junction temperature tables, airflow streamlines, and design recommendations with prototype correlation plan.
Thermal and environmental protection for autonomous vehicle and drone LiDAR.
View PageECU, BMS, and ADAS thermal management for under-hood and cabin mounting.
View PageAvionics, satellite, and UAV thermal design for altitude and radiation environments.
View PageLiquid-to-air and phase-change heat exchangers for high-heat-flux electronics.
View PageCFD enclosure thermal simulation predicts internal temperatures, identifies hotspots, and validates cooling strategies before prototype fabrication. Speak with our thermal engineers to safeguard your electronics.
Our expertise spans multiple industries with sector-specific water treatment solutions.